Industry Forum


Synthesis of TiN-BaTiO3 Core-Shell Structured Ceramics

speaker: Dr. Masayuki FUJIMOTO

  • ŸChief Technical Officer, Yageo Corp.
  • former ŸGeneral Manager, Central Research Labs., Taiyo Yuden Co., Ltd. (JAPAN)
  • Ÿformer Professor, Shizuoka University
  • ŸRichard M. Fulrath Pacific Award, American Ceramic Society

     First the topotaxial growth of perovskite BaTiO3 on TiN by a solid-state reaction between BaCO3 and TiN has been performed. The sintering of the obtained TiN-BaTiO3 core-shell structured powder in a conventional controlled-atmosphere continuous furnace is also quite unique in the sense that it mainly involves the mass transfer of BaTiO3 shell layers by diffusion. Consequently, the TiN core does not actually contribute to the sintering process, as its diffusion activity is very low. Thus, the obtained core-shell structured TiN-BaTiO3 ceramic is rather unique having a retained TiN core that can as a noncontact metallic electrode. The structure has a great potential to overcome the impasse that is currently being faced in the development of high-capacitance multi-layered ceramics capacitor (Hi-cap MLCC). Methodology of the characterization (spatially resolved electron energy loss spectroscopy; SR-EELS) and the future technical issues also are presented.


LTCC Devices for Wireless Communication

speaker: Prof. Jau-Ho JEAN

  • ŸProfessor, Department of Materials Science and Engineering, National Tsing Hua University
  • ŸFounder, Advanced Ceramic X Corp. (TAIWAN)
  • ŸFellow, American Ceramic Society and MRS-Taiwan

     Wireless communication systems demand materials and processes that can meet the requirements of shrinking circuit dimension, high level of passive integration, exceptional high frequency performance, excellent reliability, quick prototype turnaround times and low cost. Low-temperature cofired ceramics (LTCC) with high electrical conductivity metallization such as Cu and Ag has been identified to be an enabling solution for these challenges. In this presentation, design of RF circuits, materials and processes for fabrication of miniaturized LTCC devices and front-end modules will be discussed.


Electroceramics for Information and Communication Technology (ICT) Society [Past, Present and Future]

speaker: Dr. Yoshihiko IMANAKA

  • ŸDevices & Materials Laboratory, Fujitsu Laboratories Ltd. (JAPAN)

      As semiconductor advances and computers become smaller with higher functionality, the technology has extended into variety areas such as Information Communication Technology and Intelligent Transport Systems, to enrich people‘s lives. Electroceramic Packaging technology serves as vital bridge between semiconductor and computer, and makes in bringing a prosperous life. This paper addresses high-end computers and consumer products, with special focus on the ceramics and process of packaging field. Drawing on the past and present developments as well as future prospects, the paper elucidates the significance of ceramics in packaging including Low-Temperature Cofired Ceramics and energy technology for the future society.


Industrial Application of Computational Material Design for Electronic Ceramics

speaker: Dr. Yoshiki IWAZAKI

  • ŸResearch Group Leader, Research and Development Laboratory, Electronic Components Division 2, Taiyo Yuden Ltd. (JAPAN)

     Now, we can apply the computational material design to the invention of industrially useful materials. In this presentation, the application of first-principles calculation to a design of AlN based new piezoelectric material will be focused. The new material is characterized with co-doping of different valence-cation dopants at the Al site of AlN, such as simultaneously doped Mg2+ and Zr4+, Hf4+. The d33 value of the co-doped AlN reaches or exceeds the previously discovered Sc3+ doped AlN, and the performance of the co-doped AlN is also confirmed by thin-film deposition experiments with reactive sputtering equipment.


Reliability Study of Dielectric Ceramic Materials toward the Future Electronics

 speaker: Dr. Akira ANDO

  • ŸSenior Principal Researcher, New Technology Center, Corporate Technology & Business Development Unit, Murata Mfg. Co., Ltd. (JAPAN)

     A huge amount of functional ceramic components will be used in the future connected world. Multi-layered ceramic capacitor (MLCC) is one of the most widely used electronic components, and its capacitance has been increased by decreasing its dielectric ceramic layer thickness under 1 μm. The future MLCCs will be used at various conditions including extremely harsh conditions, for example, at high temperatures, under high electric fields, under high mechanical stresses, and so on. Dielectric materials in the MLCC used there should have high reliabilities against these harsh conditions. Reliability designs for these dielectric ceramic materials will be discussed.



Technical Development in MLCC Manufacturing

 speaker: Dr. Li-Wen CHU

  • ŸDirector, MLCC & CR R&D Division, Walsin Technology Corporation (TAIWAN)

     Multi-layer Ceramic Capacitor (MLCC) is a main SMD-type passive component and wildly used in electronic devices. Because of miniaturizing & multi-functioning trend of electronic device in recent years, the product demand of MLCC also tended to downsize, but possess higher capacitance and better reliability. In order to reach the superior volumetric efficiency of capacitance, the thinning process of ceramic foil (<1 μm) with finer ceramic powder (particle size< 0.2 μm) have been successfully developed in Walsin Technology Corporation. Several novel material and manufacturing technologies of MLCC will be demonstrated in this presentation.



The Application of Hydrothermal Synthesis Technology in Advanced Ceramic

 speaker: Xuekui MO

  • ŸDeputy Director, Technology Center and Vice General Manager, Alumina Business Unit, Shandong Sinocera Functional Material Co., Ltd. (CHINA)

     Hydrothermal synthesis method is a versatile technology for inorganic powder. We have prepared a lot of key material for some fields by this method. For example, nano tetragonal BaTiO3 powder for thinner film MLCC, nano (NixZn1-x)Fe2O4 powder that easy to be sintering for MLCI, nano YSZ powder with super translucency for denture, nano γ-Alumina with higher thermal stability and larger pore volume for three-way catalytic converter that meet a Euro VI omission standard, highly dispersed nano alumina powder for pigment of ceramic ink and the filler of LiB separator and , etc.